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Product search made easy. Search the suitable product from our standard products. The fastest and easiest way is by using the filter prepared for this (left side). You should select at least one piece of information, and then the EPOXONIC product finder will list all systems appropriate for you.
Products (8)
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EPOXONIC® 33
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EPOXONIC® 33 is especially suited for low stress potting of temperature sensitive electronic devices. -
EPOXONIC® 281
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EPOXONIC® 281 is especially suited for potting of temperature sensitive devices with high requirements for electrical insulation and flame retardancy. -
EPOXONIC® 283
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EPOXONIC® 283 is especially suited for potting of temperature sensitive electronic devices with high demands on mechanical properties as well as high-voltage devices. -
EPOXONIC® 341
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EPOXONIC® 341 is especially suited for potting of large electrical devices with special requirements for crack resistance at low temperatures. -
EPOXONIC® 342
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EPOXONIC® 342 is especially suited for potting of large electrical devices with high requirements for crack resistance at lower temperatures. -
EPOXONIC® 363
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EPOXONIC® 363 is especially suited for potting of closely spaced components without a capillary effect. -
EPOXONIC® 374
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EPOXONIC® 374 is especially suited for potting of temperature sensitive electronic devices as well as high-voltage devices. -
EPOXONIC® 382
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EPOXONIC® 382 is characterized by very low viscosity and proper curing at room temperature, even in thin layers. Large area bonding of temperature-sensitive substrates can be realized.