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Product search made easy. Search the suitable product from our standard products. The fastest and easiest way is by using the filter prepared for this (left side). You should select at least one piece of information, and then the EPOXONIC product finder will list all systems appropriate for you.
Products (6)
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EPOXONIC® 361
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EPOXONIC® 361 is especially suited for low stress potting of pressure sensitive electronic devices. -
EPOXONIC® 364
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EPOXONIC® 364 is especially suited for low-stress potting of components and for the thermal conductive connection of heat sinksto electronic assemblies. -
EPOXONIC® 372
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EPOXONIC® 372 is especially suited for quick fixation and bonding of devices and joining of various substrates like metals, plastics and glass. -
EPOXONIC® 373
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EPOXONIC® 373 is especially suited for low stress potting of pressure sensitive electronic devices. -
EPOXONIC® 375
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EPOXONIC® 375 is especially suited for low stress potting of pressure sensitive electrical devices with high requirements for thermal shock resistance. -
EPOXONIC® 376
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EPOXONIC® 376 is especially suited for low stress potting of pressure sensitive electrical devices with high requirements for thermal shock resistance.