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Product search made easy. Search the suitable product from our standard products. The fastest and easiest way is by using the filter prepared for this (left side). You should select at least one piece of information, and then the EPOXONIC product finder will list all systems appropriate for you.
Products (15)
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EPOXONIC® 235
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EPOXONIC® 235 is especially suited for potting of electrical devices, which have to pass lead- free soldering processes. -
EPOXONIC® 276
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EPOXONIC® 276 is especially suited for high-strength bonding of devices with need of thermal management. -
EPOXONIC® 281
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EPOXONIC® 281 is especially suited for potting of temperature sensitive devices with high requirements for electrical insulation and flame retardancy. -
EPOXONIC® 283
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EPOXONIC® 283 is especially suited for potting of temperature sensitive electronic devices with high demands on mechanical properties as well as high-voltage devices. -
EPOXONIC® 292
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EPOXONIC® 292 is especially suited for bonding of electric motor magnets and manufacturing of steel/elastomer composites. For temperature sensitive applications curing at 95 °C is possible as well. -
EPOXONIC® 341
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EPOXONIC® 341 is especially suited for potting of large electrical devices with special requirements for crack resistance at low temperatures. -
EPOXONIC® 342
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EPOXONIC® 342 is especially suited for potting of large electrical devices with high requirements for crack resistance at lower temperatures. -
EPOXONIC® 344
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EPOXONIC® 344 is especially suited for potting of electronic and electrical devices. -
EPOXONIC® 352
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EPOXONIC® 352 is especially suited for potting of electrical devices with high requirements for thermal shock resistance and chemical resistance. -
EPOXONIC® 363
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EPOXONIC® 363 is especially suited for potting of closely spaced components without a capillary effect. -
EPOXONIC® 366
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EPOXONIC® 366 is especially suited as potting compound/adhesive for automotive engineering, e.g. potting of sensors. -
EPOXONIC® 369
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EPOXONIC® 369 is especially suited for low stress bonding of substrates with different thermal expansion. -
EPOXONIC® 370
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EPOXONIC® 370 is especially suited for bonding of substrates with different thermal expansion. Curing can be done at room temperature, but optimum properties will be achieved by curing at higher temperatures. -
EPOXONIC® 374
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EPOXONIC® 374 is especially suited for potting of temperature sensitive electronic devices as well as high-voltage devices. -
EPOXONIC® 382
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EPOXONIC® 382 is characterized by very low viscosity and proper curing at room temperature, even in thin layers. Large area bonding of temperature-sensitive substrates can be realized.