The Product Finder

Find the right product,

the product finder.

Product search made easy. Search the suitable product from our standard products. The fastest and easiest way is by using the filter prepared for this (left side). You should select at least one piece of information, and then the EPOXONIC product finder will list all systems appropriate for you.

Products (8)
  • EPOXONIC® 195

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    EPOXONIC® 195 is especially suited for quick fixation and bonding of devices and joining of various substrates like metals, plastics and glass.
  • EPOXONIC® 276

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    EPOXONIC® 276 is especially suited for high-strength bonding of devices with need of thermal management.
  • EPOXONIC® 292

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    EPOXONIC® 292 is especially suited for bonding of electric motor magnets and manufacturing of steel/elastomer composites. For temperature sensitive applications curing at 95 °C is possible as well.
  • EPOXONIC® 340

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    EPOXONIC® 340 is especially suited for potting, sealing and bonding of electronic devices.
  • EPOXONIC® 366

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    EPOXONIC® 366 is especially suited as potting compound/adhesive for automotive engineering, e.g. potting of sensors.
  • EPOXONIC® 369

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    EPOXONIC® 369 is especially suited for low stress bonding of substrates with different thermal expansion.
  • EPOXONIC® 370

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    EPOXONIC® 370 is especially suited for bonding of substrates with different thermal expansion. Curing can be done at room temperature, but optimum properties will be achieved by curing at higher temperatures.
  • EPOXONIC® 372

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    EPOXONIC® 372 is especially suited for quick fixation and bonding of devices and joining of various substrates like metals, plastics and glass.