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Products (3)
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EPOXONIC® 195
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EPOXONIC® 195 is especially suited for quick fixation and bonding of devices and joining of various substrates like metals, plastics and glass. -
EPOXONIC® 372
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EPOXONIC® 372 is especially suited for quick fixation and bonding of devices and joining of various substrates like metals, plastics and glass. -
EPOXONIC® 382
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EPOXONIC® 382 is characterized by very low viscosity and proper curing at room temperature, even in thin layers. Large area bonding of temperature-sensitive substrates can be realized.