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the product finder.

Product search made easy. Search the suitable product from our standard products. The fastest and easiest way is by using the filter prepared for this (left side). You should select at least one piece of information, and then the EPOXONIC product finder will list all systems appropriate for you.

Products (21)
  • EPOXONIC® 33

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    EPOXONIC® 33 is especially suited for low stress potting of temperature sensitive electronic devices.
  • EPOXONIC® 195

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    EPOXONIC® 195 is especially suited for quick fixation and bonding of devices and joining of various substrates like metals, plastics and glass.
  • EPOXONIC® 235

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    EPOXONIC® 235 is especially suited for potting of electrical devices, which have to pass lead- free soldering processes.
  • EPOXONIC® 276

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    EPOXONIC® 276 is especially suited for high-strength bonding of devices with need of thermal management.
  • EPOXONIC® 281

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    EPOXONIC® 281 is especially suited for potting of temperature sensitive devices with high requirements for electrical insulation and flame retardancy.
  • EPOXONIC® 283

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    EPOXONIC® 283 is especially suited for potting of temperature sensitive electronic devices with high demands on mechanical properties as well as high-voltage devices.
  • EPOXONIC® 292

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    EPOXONIC® 292 is especially suited for bonding of electric motor magnets and manufacturing of steel/elastomer composites. For temperature sensitive applications curing at 95 °C is possible as well.
  • EPOXONIC® 340

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    EPOXONIC® 340 is especially suited for potting, sealing and bonding of electronic devices.
  • EPOXONIC® 341

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    EPOXONIC® 341 is especially suited for potting of large electrical devices with special requirements for crack resistance at low temperatures.
  • EPOXONIC® 344

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    EPOXONIC® 344 is especially suited for potting of electronic and electrical devices.
  • EPOXONIC® 352

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    EPOXONIC® 352 is especially suited for potting of electrical devices with high requirements for thermal shock resistance and chemical resistance.
  • EPOXONIC® 361

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    EPOXONIC® 361 is especially suited for low stress potting of pressure sensitive electronic devices.
  • EPOXONIC® 363

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    EPOXONIC® 363 is especially suited for potting of closely spaced components without a capillary effect.
  • EPOXONIC® 364

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    EPOXONIC® 364 is especially suited for low-stress potting of components and for the thermal conductive connection of heat sinksto electronic assemblies.
  • EPOXONIC® 366

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    EPOXONIC® 366 is especially suited as potting compound/adhesive for automotive engineering, e.g. potting of sensors.
  • EPOXONIC® 369

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    EPOXONIC® 369 is especially suited for low stress bonding of substrates with different thermal expansion.
  • EPOXONIC® 372

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    EPOXONIC® 372 is especially suited for quick fixation and bonding of devices and joining of various substrates like metals, plastics and glass.
  • EPOXONIC® 373

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    EPOXONIC® 373 is especially suited for low stress potting of pressure sensitive electronic devices.
  • EPOXONIC® 374

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    EPOXONIC® 374 is especially suited for potting of temperature sensitive electronic devices as well as high-voltage devices.
  • EPOXONIC® 375

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    EPOXONIC® 375 is especially suited for low stress potting of pressure sensitive electrical devices with high requirements for thermal shock resistance.
  • EPOXONIC® 376

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    EPOXONIC® 376 is especially suited for low stress potting of pressure sensitive electrical devices with high requirements for thermal shock resistance.