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Product search made easy. Search the suitable product from our standard products. The fastest and easiest way is by using the filter prepared for this (left side). You should select at least one piece of information, and then the EPOXONIC product finder will list all systems appropriate for you.

Products (16)
  • EPOXONIC ® 33

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    EPOXONIC® 33 is especially suited for low stress potting of temperature sensitive electronic devices with high demands on mechanical properties (e.g. PCB).
  • EPOXONIC ® 195

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    EPOXONIC® 195 is especially suited for quick fixation and bonding of devices and joining of various substrates like metals, plastics and glass.
  • EPOXONIC ® 235

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    EPOXONIC® 235 is especially suited for potting of electrical devices, which have to pass lead-free soldering processes (e.g. relays).
  • EPOXONIC ® 241

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    EPOXONIC® 241 is especially suited for potting of electrical devices with high requirements for thermal shock resistance and chemical resistance.
  • EPOXONIC ® 275

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    EPOXONIC® 275 is especially suited for low stress potting of pressure and vibration sensitive electronic devices with special demands on flame-resistance.
  • EPOXONIC ® 276

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    EPOXONIC® 276 is especially suited for high-strength bonding of devices with need of thermal management (e.g. power semiconductors).
  • EPOXONIC ® 281

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    EPOXONIC® 281 is especially suited for potting of temperature sensitive devices with high demands on mechanical properties (e.g. crack-resistance).
  • EPOXONIC ® 283

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    EPOXONIC® 283 is especially suited for potting of temperature sensitive electronic devices with high demands on mechanical properties (e.g. Automotive Electronics) as well as high-voltage devices (e.g. high-voltage plugs).
  • EPOXONIC ® 292

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    EPOXONIC® 292 is especially suited for bonding of electric motor magnets. For temperature sensitive applications curing at 95 °C is possible as well.
  • EPOXONIC ® 333

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    EPOXONIC® 333 is especially suited for special demands on temperature stability and temperature shock stability.
  • EPOXONIC ® 341

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    EPOXONIC® 341 is especially suited for potting of large electrical devices with high requirements for thermal shock resistance.
  • EPOXONIC ® 344

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    EPOXONIC® 344 is especially suited for potting of electronic devices (e.g. high voltage plugs).
  • EPOXONIC ® 356

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    EPOXONIC® 356 is especially suited for low stress potting of pressure sensitive electronic devices (e.g. inductive components, sensors).
  • EPOXONIC ® EX 2802

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    EPOXONIC® EX 2802 is especially suited for low stress bonding of substrates with different thermal expansion. EPOXONIC® EX 2802 features the possibility of quick fixation.
  • EPOXONIC ® EX 3483

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    EPOXONIC® EX 3483 is especially suited as flexible potting material with high thermal conductivity for low stress potting of electrical devices.
  • EPOXONIC ® EX 3525

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    EPOXONIC® EX 3525 is especially suited for low stress bonding of substrates with different thermal expansion (e.g. polycarbonate/glass-composites).