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Products (4)
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EPOXONIC® 341
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EPOXONIC® 341 is especially suited for potting of large electrical devices with special requirements for crack resistance at low temperatures. -
EPOXONIC® 344
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EPOXONIC® 344 is especially suited for potting of electronic and electrical devices. -
EPOXONIC® 363
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EPOXONIC® 363 is especially suited for potting of closely spaced components without a capillary effect. -
EPOXONIC® 382
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EPOXONIC® 382 is characterized by very low viscosity and proper curing at room temperature, even in thin layers. Large area bonding of temperature-sensitive substrates can be realized.