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Product search made easy. Search the suitable product from our standard products. The fastest and easiest way is by using the filter prepared for this (left side). You should select at least one piece of information, and then the EPOXONIC product finder will list all systems appropriate for you.

Products (14)
  • EPOXONIC® 276

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    EPOXONIC® 276 is especially suited for high-strength bonding of devices with need of thermal management.
  • EPOXONIC® 292

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    EPOXONIC® 292 is especially suited for bonding of electric motor magnets and manufacturing of steel/elastomer composites. For temperature sensitive applications curing at 95 °C is possible as well.
  • EPOXONIC® 341

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    EPOXONIC® 341 is especially suited for potting of large electrical devices with special requirements for crack resistance at low temperatures.
  • EPOXONIC® 342

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    EPOXONIC® 342 is especially suited for potting of large electrical devices with high requirements for crack resistance at lower temperatures.
  • EPOXONIC® 344

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    EPOXONIC® 344 is especially suited for potting of electronic and electrical devices.
  • EPOXONIC® 361

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    EPOXONIC® 361 is especially suited for low stress potting of pressure sensitive electronic devices.
  • EPOXONIC® 363

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    EPOXONIC® 363 is especially suited for potting of closely spaced components without a capillary effect.
  • EPOXONIC® 364

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    EPOXONIC® 364 is especially suited for low-stress potting of components and for the thermal conductive connection of heat sinksto electronic assemblies.
  • EPOXONIC® 366

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    EPOXONIC® 366 is especially suited as potting compound/adhesive for automotive engineering, e.g. potting of sensors.
  • EPOXONIC® 369

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    EPOXONIC® 369 is especially suited for low stress bonding of substrates with different thermal expansion.
  • EPOXONIC® 370

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    EPOXONIC® 370 is especially suited for bonding of substrates with different thermal expansion. Curing can be done at room temperature, but optimum properties will be achieved by curing at higher temperatures.
  • EPOXONIC® 373

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    EPOXONIC® 373 is especially suited for low stress potting of pressure sensitive electronic devices.
  • EPOXONIC® 375

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    EPOXONIC® 375 is especially suited for low stress potting of pressure sensitive electrical devices with high requirements for thermal shock resistance.
  • EPOXONIC® 376

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    EPOXONIC® 376 is especially suited for low stress potting of pressure sensitive electrical devices with high requirements for thermal shock resistance.