New measurement device for characterization of highly flexible epoxy resins
Flexible epoxy resins, applied as adhesives or potting compounds, are one of EPOXONIC´s specialties. These materials with a hardness Shore A 30 and a glass transition temperature at -40 °C feature long- term thermal stability up to 150 °C. DSC-1, a new thermoanalytical measurement device from Mettler-Toledo, provides comprehensive possibilities to characterize such highly flexible systems and to develop new tailor-made formulations.
Flexible epoxy resins are used e.g. for potting of pressure-sensitive electronic devices. In adhesive applications these materials can help to reduce mechanical stress within the bond line, caused by thermal mismatch of the bonded substrates.