New epoxy resin compounds – highly flexible and silicone-free
Epoxy resin compounds are well known as brittle materials with very high strength. Properties like flexibility, high elongation and low modulus are normally associated with polyurethanes and silicones.
EPOXONIC´s flexible epoxy resins show elongation at break up to 350 % and hardness values below Shore A10. This flexibility is combined with a long-term heat resistance up to 150 °C, even up to 180 °C for short time exposure. Therefore these products offer in many cases an optimum alternative if a silicone-free material is needed.
Long-term investigations performed by EPOXONIC´s customers show that the flexibility is maintained to a large extent if the material is exposed to 150 °C. There are products available which retain more than 50 % of their original elongation at break after 2000 hours at 150 °C, special types retain more than 70 %. These materials with glass transition temperatures of about -40 °C are very well suited for temperature shock requirements.
Flexible epoxy resins are used e.g. for potting of pressure-sensitive electronic devices and for the manufacturing of silicone-free thermally conductive foils. In adhesive applications these materials can help to reduce mechanical stress within the bond line, caused by thermal mismatch of the bonded substrates.