Products - EPOXONIC

Our products are wide ranging and can be manufactured for individual applications

Epoxy resin formulations, also lovingly known as EPOXIES, are versatile plastics that are found in almost all areas of daily life. We not only offer individual custom solutions from the field of special resins but also have suitable standard products for industrial applications in our product portfolio.

Adhesive bonding

In the professional sector, there is no such thing as an all-purpose adhesive. Each problem requires an individual solution, taking into account the substrate, adhesive surface and adhesive gap. Our product portfolio includes both 1-component and 2-component adhesives, which cure based on a range of mechanisms (cold-curing, heat-curing, UV rays, dual cure).

Casting

Epoxy resin casting compounds impress with a variety of processing and moulding material properties. The viscosity ranges from watery to pasty.

These optimised, thermally and chemically stable epoxy resin casting compounds are ideal for automated processing in production lines but also for manual casting tasks for highly complex components. Thanks to the individual formulations, they can cover a range of properties from thermally conductive to flame-retardant to highly flexible.

Renovation

EPOXONIC sewer renovation products are characterised by being user-friendly and are especially suitable for high-tech processing using robots.

Special properties include, for example, curing at low temperatures, on wet surfaces or good chemical stability. We have provided proof of our excellent product quality with the DIBt approval (D) and the VSA approval (CH).

Information and distribution by Fluvius GmbH: www.fluvius.info

You are not quite sure yet which product suits you?

No problem – we will be happy to help you find the right product.

Are you looking for suitable casting resins and adhesives?
Do you need a product tailored to your application?
Do you need advice on the preparation of the components and processing of our materials?
Do you have any questions about the occupational safety and environmental protection rules that apply for our epoxy resin formulations?

Just contact us OR use our product finder!

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Finding the right product made easy

Find the right product for your needs and use the corresponding filter functions to get to our standard products.

For all products, we have saved the respective product properties and applications for you.
If you have any questions or prefer customised advice, please do not hesitate to contact us.

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Product

Renovation products

Branch

Construction industry

PRODUCTS (18)

EPOXONIC 33
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EPOXONIC 33 is especially suited for low stress potting of temperature sensitive electronic devices.

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EPOXONIC 235
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EPOXONIC 235 is especially suited for potting of electrical devices, which have to pass lead- free soldering processes.

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EPOXONIC 281
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EPOXONIC 281 is especially suited for potting of temperature sensitive devices with high requirements for electrical insulation and flame retardancy.

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EPOXONIC 283
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EPOXONIC 283 is especially suited for potting of temperature sensitive electronic devices with high demands on mechanical properties as well as high-voltage devices.

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EPOXONIC 341
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EPOXONIC 341 is especially suited for potting of large electrical devices with special requirements for crack resistance at low temperatures.

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EPOXONIC 342
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EPOXONIC 342 is especially suited for potting of large electrical devices with high requirements for crack resistance at lower temperatures.

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EPOXONIC 344
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EPOXONIC 344 is especially suited for potting of electronic and electrical devices.

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EPOXONIC 352
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EPOXONIC 352 is especially suited for potting of electrical devices with high requirements for thermal shock resistance and chemical resistance.

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EPOXONIC 361
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EPOXONIC 361 is especially suited for low stress potting of pressure sensitive electronic devices.

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EPOXONIC 363
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EPOXONIC 363 is especially suited for potting of closely spaced components without a capillary effect.

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EPOXONIC 364
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EPOXONIC 364 is especially suited for low-stress potting of components and for the thermal conductive connection of heat sinksto electronic assemblies.

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EPOXONIC 369
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EPOXONIC 369 is especially suited for low stress bonding of substrates with different thermal expansion.

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EPOXONIC 370
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EPOXONIC 370 is especially suited for bonding of substrates with different thermal expansion. Curing can be done at room temperature, but optimum properties will be achieved by curing at higher temperatures.

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EPOXONIC 373
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EPOXONIC 373 is especially suited for low stress potting of pressure sensitive electronic devices.

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EPOXONIC 374
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EPOXONIC 374 is especially suited for potting of temperature sensitive electronic devices as well as high-voltage devices.

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EPOXONIC 375
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EPOXONIC 375 is especially suited for low stress potting of pressure sensitive electrical devices with high requirements for thermal shock resistance.

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EPOXONIC 376
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EPOXONIC 376 is especially suited for low stress potting of pressure sensitive electrical devices with high requirements for thermal shock resistance.

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EPOXONIC 382
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EPOXONIC 382 is characterized by very low viscosity and proper curing at room temperature, even in thin layers. Large area bonding of temperature-sensitive substrates can be realized.

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In addition to numerous epoxy resin formulations, we also offer adhesives and casting resins for professional further processing as part of industrial applications.