products/electronics | potting compounds
Potting Compounds (Examples)
| PRODUCT | FEATURES | APPLICATION | DOWNLOAD |
|---|---|---|---|
| EPOXONIC® 17 | High flexibility High thermal conductivity Free of E-corrosion |
power modules, temperature sensors, inductive components |  TDS EPOXONIC 17 e.pdf |
| EPOXONIC® 33 | Room temperature curing Good thermal conductivity Low stress |
Potting of PCBs and stress sensitive parts | TDS EPOXONIC 33 e.pdf |
| EPOXONIC® 43 | chemically resistant good temperature cycle performance impact resistant |
automobile components high voltage plugs |
TDS EPOXONIC 43 e.pdf |
| EPOXONIC® 59 | good handling at room temperature good adhesion high glass transition temperature |
universal potting compound, especially for small components |
TDS EPOXONIC 59 e.pdf |
| EPOXONIC® 73 | high-temperature resistant impact resistant |
sensors for the automotive industry | TDS EPOXONIC 73 e.pdf |
| EPOXONIC® 235 | low viscosity Flame-resistant |
Potting compound for lead-free soldering process (e.g. relays) | TDS EPOXONIC 235 e.pdf |
| EPOXONIC® 241 | flame resistant thermally conductive good flowability |
Universal potting compound for electrical and electronic applications | TDS EPOXONIC 241 e.pdf |
| EPOXONIC® 251 | Operating temperature up to 150°C Highly flexible low stress low viscosity also available as 1 part system |
pressure and vibration-sensitive components and assemblies Ferrite components inductive components |
TDS EPOXONIC 251 e.pdf |
| EPOXONIC® 260 | thermally conductive highly flexible high filler content |
pressure and vibration-sensitive components and assemblies heat conductive films potting of temperature sensitive parts |
TDS EPOXONIC 260 e.pdf |
| EPOXONIC® 278 | Flame resistant Highly flexible Thermally conductive |
Flame-resistant version of EPOXONIC® 251 | TDS EPOXONIC 278 e.pdf |
| EPOXONIC® 281 | Flame resistant Thermally conductive Good flowability |
Room temperature curing version of EPOXONIC® 241 | TDS EPOXONIC 281 e.pdf |
| EPOXONIC® 283 | chemically resistant good temperature cycle performance impact resistant |
Room temperature curing version of EPOXONIC® 43 | TDS EPOXONIC 283 e.pdf |
| EPOXONIC® 284 | Good stress-strain behavior Medium flexibility Flame-resistant Thermally conductive |
Universal potting compound with medium flexibility | TDS EPOXONIC 284 e.pdf |
The development of potting compounds for critical applications via the use of low chloride resins is possible on request
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