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May 2010 – Highly flexible, hardly flammable casting compound
EPOXONIC© 278 satisfies the requirements of UL94 V0 and is sustained temperature resistant up to 150° making it suitable for the casting of high-volume batches.
EPOXONIC© presents a viscoplastic 1K adhesive with good thermal conductivity for increased temperature requirements February 2009 – flexible UV adhesive
Quick low-tension connection of substrates with differing thermal expansion, short-term temperature resistant up to 150°C. August 2008 – Market launch of EDS-Sensyflex
Epoxide sealing material for the renewal of seals in pipe joints in effluent water conduits using robotics. December 2007 – 1-component adhesive with nanofiller
Viscoplastic adhesive for sustained temperatures of 120°C; short-term temperature-resistant up to 150°C; the adhesive is not subject to any special shipping instructions. May 2007 – DIBt approval for EPOXONIC® resins
EPOXONIC® resins for the repair and renovation of effluent water conduits in combination with the robotic procedure receive approval from the German Institute for Building Engineering (DIBt). April 2007 – Lead- and cadmium-free Einbrennsilber
EPOXONIC®-Einbrennsilber silver used for example for the metallization of ceramic building elements represent the state of the art in terms of environmental sustainability December 2006 – Highly flexible epoxy resin for sustained temperatures of 150°C
The rendering flexible of the casting resins and adhesives reaches down to the lower Shore-A range and also remains permanently stable at temperatures of up to 150°C (2000 h endurance test), applications in the engine compartment October 2006 – Flexible casting resin for heat-conducting foils
Heat-conducting foils for the thermal contacting of heat-sinks on components in power electronics, heat-conducting capacity > 1 W/mK. April 2005 – Chlorine-free epoxy resin casting compound for automobile electrics
Low-stress embedding of corrosion-sensitive electronic components in the field of automobile electrics; reduced aging of the micro-electronic components.