products/electronics | coating materials
Coating Materials (Examples)
| PRODUCT | FEATURES | APPLICATION | DOWNLOAD |
|---|---|---|---|
| EPOXONIC® 29 Glob Top |
very low expansion coefficient (CTE) good handling properties |
chip on board potting of small components |
 TDS EPOXONIC 29 e.pdf |
| EPOXONIC® 122 Aluminum Paste |
screen printable low-cost metallization |
conductive coating for PTC-components | TDS EPOXONIC 122 e.pdf |
| EPOXONIC® 128 Silver glass Paste |
lead- and cadmium-free silver glass paste | metallization of ceramic and electro-ceramic components |
TDS EPOXONIC 128 e.pdf |
| EPOXONIC® 153 Silver glass Paste |
lead-containing silver glass paste lower organic burn-out temperatures than with lead-free silver glass pastes |
metallization of ceramic and electro-ceramic components |
TDS EPOXONIC 153 e.pdf |
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