products/electronics | adhesives
Adhesives (Examples)
| PRODUCT | FEATURES | APPLICATION | DOWNLOAD |
|---|---|---|---|
| EPOXONIC® 50 | 2-part adhesive transparent low viscosity |
fiber optics |  TDS EPOXONIC 50 e.pdf |
| EPOXONIC® 71 | 1-part adhesive Silver filled Highly flexible Low chloride content |
Adhesive for large dies Electrostatic discharge |
TDS EPOXONIC 71 e.pdf |
| EPOXONIC® 126 Electrically conductive adhesive |
1-part adhesive Silver filled low stress long pot life at room temperature |
lead-free solder replacement | TDS EPOXONIC 126 e.pdf |
| EPOXONIC® 195 UV-adhesive |
dual-cure adhesive (UV and thermal) unfilled |
adhesive for glass quick bonding |
TDS EPOXONIC 195 e.pdf |
| EPOXONIC® 274 | 1-part adhesive filled with nano-particles High toughness |
Temperature stable bonding of metals and many plastics | TDS EPOXONIC 274 e.pdf |
| EPOXONIC® 275 | 1-part adhesive with nanofiller Highly thixotropic storage at + 2 to +8°C |
More thixotropic version of EPOXONIC® 274 | TDS EPOXONIC 275 e.pdf |
| EPOXONIC® 276 | 1-part adhesive thermally conductive impact resistant |
Adhesive for heat sinks Heat dissipation of temperature sensitive components |
TDS EPOXONIC 276 e.pdf |
The development of adhesives for critical applications via the use of low chloride resins is possible on request
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